Effect of Cold Working on Microstructure and Performance of CuCrZr Alloys

Additonal authors: Chen, H. M.. Book title: Proceedings of the 58th Conference of Metallurgists Hosting Copper 2019. Chapter: . Chapter title:

Proceedings, Vol. Proceedings of the 58th Conference of Metallurgists Hosting Copper 2019, 2019

Huang, H.

Cu-0.8Cr-0.1Zr alloy were prepared by atmospheric melting. the microstructure and properties of the CuCrZr alloy after first cold rolled, solid solution, second cold rolled and aging treatment were analyzed by using optical microscope, electrical conductivity analysis and Vickers hardness tester. The results show that with the increase of the first cold rolled deformation, the grain breakage becomes more serious, and the cold hardening becomes more obvious and the hardness increases. The conductivity and peak hardness of the first cold rolled (reduction of 30% and 60%) alloys after solution, secondary cold rolled and aging treatment reaches 81 %IACS and 187 HV, respectively. However, the conductivity in the CuCrZr alloy with a higher rolling degree (reduction of 90%) after solution, secondary cold rolling and aging treatment is significantly higher, and the conductivity and peak hardness is 85.8 %IACS and 178 HV, respectively. INTRODUCTION CuCrZr alloy has been widely used in domestic industry for its excellent comprehensive properties such as high strength and high conductivity, especially in the contact wire and lead frame of high-speed railway (Sun, Tao, & Lu, 2015; Mishnev, Shakhova, Belyakov, & Kaibyshev, 2015; Zhang et al., 2016; Fu et al., 2017). In recent years, a lot of research has been done on how to improve the strength and conductivity of CuCrZr alloy. However, the high strength and high conductivity of copper alloys are contradictory characteristics. On the one hand, the addition of alloying elements is conducive to solution strengthening and aging strengthening; on the other hand, too much alloying elements in copper alloys cause defects in the lattice of copper matrix, resulting in a serious decline in the conductivity of copper alloys (Martienssen & Walirmont, 2005). How to obtain high strength and high conductivity at the same time is the main problem. At present, the main research methods are adding microalloying elements, thermomechanical treatment and severe plastic deformation to study the electrical conductivity and mechanical properties of CuCrZr alloys. For example, Xie et al. (2011) added trace Ag to the Cu-0.26 wt%Cr-0.08 wt%Zr alloy, and the size of precipitated phase Cr and Cu4Zr became smaller and the mechanical properties of the alloy were improved. Su, Dong, Liu, Li, & Kang (2004) found that the addition of trace Mg in CuCrZr alloy inhibits the growth of precipitated phase and reduces the internal stress around the precipitated phase. At the same time, the size of precipitated phase becomes smaller and the peak aging strength of the alloy is improved. Pang et al. (2013) found that adding trace Ni and Si to the CuCrZr alloy could improve the peak hardness, softening resistance and precipitation morphology of the alloy. Experiments shows that the grain size was significantly refined by equal channel angular extrusion combined with aging treatment, while the strength of the alloy was increased, and the electrical conductivity of the alloy did not decrease (Vinogradov, Patlan, Suzuki, Kitagawa, & Kopylov, 2002; Saray, 2016); Kermajani, Raygan, Hanayi, & Ghaffari (2013) showed that the strength of CuCrZr alloy can be improved by rolling at 500 °C. After 150 minutes of aging treatment, the strength and conductivity of the material increased to 431 MPa and 81 %IACS, respectively. Takata, Ohtake, Kita, Kitagawa, and Tsuji (2009) noted that the strain hardening, uniform elongation and tensile strength of the nano-precipitates produced by the mechanical heat treatment process can be notable enhanced. The mechanical and electrical properties of CuCrZr alloy can be improved by combining large plastic deformation with aging treatment in the test process (Gao, Huttunen-Saarivirta, Tiainen, & Hemmila, 2003; Huang et al., 2003; Xia et al., 2012; Zel’dovich et al., 2014).
Keywords: Copper 2019, COM2019
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