Fundamental Study on E-Scrap Recycling Technique Using Alkaline Medium

Additonal authors: Saito, N.. Book title: Proceedings of the 58th Conference of Metallurgists Hosting Copper 2019. Chapter: . Chapter title:

Proceedings, Vol. Proceedings of the 58th Conference of Metallurgists Hosting Copper 2019, 2019

Taninouchi, Y.

Recycling of e-scrap is often performed by utilizing a pyrometallurgical Cu smelting process. Several valuable metals, including precious metals, can be efficiently recovered through the Cu smelting process. However, recovery of Sn is quite difficult because it is distributed in slag during the smelting process. Sn is used as solder and plating in electronic devices, and its recycling will be more important in the future. In light of this background, a pretreatment process that can extract Sn directly and selectively from e-scrap was developed in this study. The proposed Sn extraction process involves alkaline leaching using iodate ions, IO 3, as an oxidizing agent. We conducted leaching experiments for Sn, Sn-Ag-Cu alloy solder, and Cu, and the effective dissolution of Sn was confirmed. In principle, the electrodeposition of Sn from the leach solution and regeneration of IO3 are possible by a subsequent electrolysis process. The results obtained in this study suggest that the proposed leaching process can be an effective and useful pretreatment for Cu-smelting-based e-scrap recycling. INTRODUCTION Electronic scrap (e-scrap), including waste printed circuit boards (PCBs), is one of the fastest growing waste treatment streams in the global urban environment. E-scrap contains numerous valuable metallic elements, including Cu, Sn, and precious metals, in rich quantity. Furthermore, some metals and other materials contained in e- scrap are hazardous to human health and the environment when they are not properly managed. The recycling of e- scrap is therefore a major concern in terms of resource supply and waste treatment, and it has been performed by many companies using a variety of methods.
Keywords: Copper 2019, COM2019